<efrbr:recordSet xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:efrbr="http://vfrbr.info/efrbr/1.1" xmlns:efrbr-work="http://vfrbr.info/efrbr/1.1/work" xmlns:efrbr-expression="http://vfrbr.info/efrbr/1.1/expression" xmlns:efrbr-manifestation="http://vfrbr.info/efrbr/1.1/manifestation" xmlns:efrbr-person="http://vfrbr.info/efrbr/1.1/person" xmlns:efrbr-corporateBody="http://vfrbr.info/efrbr/1.1/corporateBody" xmlns:efrbr-concept="http://vfrbr.info/efrbr/1.1/concept" xmlns:efrbr-structure="http://vfrbr.info/efrbr/1.1/structure" xmlns:efrbr-responsible="http://vfrbr.info/efrbr/1.1/responsible" xmlns:efrbr-subject="http://vfrbr.info/efrbr/1.1/subject" xmlns:efrbr-other="http://vfrbr.info/efrbr/1.1/other" xsi:schemaLocation="http://vfrbr.info/efrbr/1.1 http://vfrbr.info/schemas/1.1/efrbr.xsd"><efrbr:entities><efrbr-work:work identifier="http://purl.tuc.gr/dl/dias/4A45A9E9-F32E-4605-85BB-3A15A5888242"><efrbr-work:titleOfTheWork>Modelling of 4H-SiC VJFETS with self-aligned contacts</efrbr-work:titleOfTheWork></efrbr-work:work><efrbr-expression:expression identifier="http://purl.tuc.gr/dl/dias/4A45A9E9-F32E-4605-85BB-3A15A5888242"><efrbr-expression:titleOfTheExpression>Modelling of 4H-SiC VJFETS with self-aligned contacts</efrbr-expression:titleOfTheExpression><efrbr-expression:formOfExpression vocabulary="DIAS:TYPES">
            Πλήρης Δημοσίευση σε Συνέδριο
            Conference Full Paper
         </efrbr-expression:formOfExpression><efrbr-expression:dateOfExpression type="issued">2018-11-16</efrbr-expression:dateOfExpression><efrbr-expression:dateOfExpression type="published">2016</efrbr-expression:dateOfExpression><efrbr-expression:languageOfExpression vocabulary="iso639-1">en</efrbr-expression:languageOfExpression><efrbr-expression:summarizationOfContent>Purely vertical 4H-SiC JFETs have been modeled by using three different approaches: the analytical model, the finite element model and the compact model. The results of the modelling have been compared with experimental results obtained on a series of fabricated self-aligned devices with two different channel lengths (0.3 and 1.1μm) and various channel widths (1.5, 2, 2.5, 3, 4 and 5 μm). For all the considered models I-V and C-V characteristics could be satisfactorily simulated.</efrbr-expression:summarizationOfContent><efrbr-expression:useRestrictionsOnTheExpression type="creative-commons">http://creativecommons.org/licenses/by/4.0/</efrbr-expression:useRestrictionsOnTheExpression><efrbr-expression:note type="page range">913-916</efrbr-expression:note><efrbr-expression:note type="conference name">16th International Conference on Silicon Carbide and Related Materials</efrbr-expression:note><efrbr-expression:note type="proceedings title">Materials Science Forum</efrbr-expression:note></efrbr-expression:expression><efrbr-person:person identifier="http://viaf.org/viaf/313553560"><efrbr-person:nameOfPerson vocabulary="VIAF">
            Zekentes, Konstantinos
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            Vassilevski Konstantin V.
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            Stavrinidis Antonis
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            Konstantinidis Georgios
            Κωνσταντινιδης Γεωργιος
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            Kayambaki Maria
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            Vamvoukakis Konstantinos
            Βαμβουκακης Κωνσταντινος
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            Vassakis Emmanouil
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            Peyré Hervé
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            Makris Nikolaos
            Μακρης Νικολαος
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            Bucher Matthias
            Bucher Matthias
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            Schmid Patrick
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            Stefanakis Dionyssios
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            Tassis, Dimitrios
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            Trans Tech Publications
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            Compact model
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            JFET
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            TCAD
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            Transistor
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