Sputtering rates and nanoscale cluster production in a hollow-cathode apparatusSputtering rates and nanoscale cluster production in a hollow-cathode apparatus Peer-Reviewed Journal Publication Δημοσίευση σε Περιοδικό με Κριτές 2015-12-021996enBy combining a hollow-cathode plasma sputter device with the gas aggregation technique, an intense source of nanoscale metal clusters has been developed. Net sputtering rates have been measured as a function of pressure, flow velocity, electric current and cathode geometry, and in most instances they were found to behave differently than their planar-electrode sputtering counterparts. Deposition rates on substrates located away from the hot plasma region have been also measured. Clusters of Cu, Ag, Au and Ta have been produced and their size has been determined via XRD and TEM. The size of Cun clusters is found to increase with the sputter source discharge current.http://creativecommons.org/licenses/by/4.0/Nanostructured Materials75473-486 Katsanos Anastasios Κατσανος Αναστασιος Clouvas, Alexandre, 19..- Papastaikoudis, Constantin Potiriadis Constantinos Trouposkiadis P. Xenoulis Alexander C. Elsevier Nanostructured materials