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Institutional Repository [SANDBOX]
Technical University of Crete
Technical University of Crete
EN
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EL
| URI | http://purl.tuc.gr/dl/dias/6A16A89F-F1CB-418E-B433-8790C9D12405 | - |
| Identifier | https://doi.org/10.1145/3415264.3425457 | - |
| Identifier | https://dl.acm.org/doi/10.1145/3415264.3425457 | - |
| Language | en | - |
| Extent | 2 pages | en |
| Title | Wireless embedded system on a glove for hand motion capture and tactile feedback in 3D environments | en |
| Creator | Effraimidis Michail | en |
| Creator | Ευφραιμιδης Μιχαηλ | el |
| Creator | Mania Aikaterini | en |
| Creator | Μανια Αικατερινη | el |
| Publisher | Association for Computing Machinery (ACM) | en |
| Description | 13th ACM SIGGRAPH conference and exhibition on computer graphics and interactive techniques in Asia, virtual event, Republic of Korea, December 4 - 13, 2020 | en |
| Content Summary | Wearable haptics, compatible with Virtual Reality applications for remote interaction, are still heavily reliant on cumbersome wired systems, restricting user movement. We present an innovative, component-based, wireless embedded system on a glove with hand motion capture providing tactile feedback, operating without the need for a finger tracking device such as the Leap Motion. The user’s hand is tracked by an infrared filter pass camera which detects three infrared LEDs attached on the 3D printed base on the glove. The system is built using inexpensive parts making it ideal for prototyping and customization, therefore resulting to a scalable and upgradable system. | en |
| Type of Item | Αφίσα σε Συνέδριο | el |
| Type of Item | Conference Poster | en |
| License | http://creativecommons.org/licenses/by/4.0/ | en |
| Date of Item | 2021-12-21 | - |
| Date of Publication | 2020 | - |
| Subject | Infrared tracking | en |
| Subject | Embedded systems | en |
| Subject | 3D environments | en |
| Subject | Haptics | en |
| Bibliographic Citation | M. Efraimidis and K. Mania, “Wireless embedded system on a glove for hand motion capture and tactile feedback in 3D environments”, in SIGGRAPH Asia 2020, pp. 1–2. doi: 10.1145/3415264.3425457 | en |
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