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Institutional Repository [SANDBOX]
Technical University of Crete
Technical University of Crete
EN
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EL
| URI | http://purl.tuc.gr/dl/dias/2B05886A-D60C-4117-BAAA-37747E818594 | - |
| Identifier | https://doi.org/10.1145/1228784.1228810 | - |
| Language | en | - |
| Title | A buffered crossbar-based chip interconnection framework supporting quality of service | en |
| Creator | Papaefstathiou Ioannis | en |
| Creator | Παπαευσταθιου Ιωαννης | el |
| Creator | Kornaros Georgios | en |
| Creator | Κορναρος Γεωργιος | el |
| Creator | Chrysos Nikolaos | en |
| Publisher | Association for Computing Machinery | en |
| Content Summary | As Systems-on-a-Chip (SoCs) become larger, the problem of interconnecting the various subsystems becomes more complicated. In this framework, certain alternatives to the standard buses, based on Network Technologies, have emerged as innovative approaches for SoC's interconnect. One of the main advantages of such an alternative, is that it can offer certain Quality of Service (QoS) over the internal cross-connects while at the same time it supports higher transfer rates than the existing on-chip buses. This paper presents the first chip interconnection architecture, which is based on a buffered crossbar switch. The main advantage of the proposed system is that it efficiently supports different priority levels; it also provides several Gigabits per Second of aggregate bandwidth, while it introduces very low latency. Moreover, the hardware complexity of this highly scalable scheme is minimal. All those facts make this framework ideal for SoCs that contain IP cores with diverse speed/throughput requirements. | en |
| Type of Item | Πλήρης Δημοσίευση σε Συνέδριο | el |
| Type of Item | Conference Full Paper | en |
| License | http://creativecommons.org/licenses/by/4.0/ | en |
| Date of Item | 2015-11-15 | - |
| Date of Publication | 2007 | - |
| Bibliographic Citation | I. Papaefstathiou, G. Kornaros, N. Chrysos, "A buffered crossbar-based chip interconnection framework supporting quality of service," in 17th ACM Great Lakes symposium on VLSI, 2007, pp. 90-95 . doi: 10.1145/1228784.1228810 | en |
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